Work is well under way with the completion of the printed circuit board design for the main hardware component of the HINDSYHT project. This module measures 50mm x 80mm and it hosts both the ultrasonic wave transmitter and receiver in addition to the main processing unit and digital communications’ surrounding circuitry.

The plan carries on according to schedule; with the firmware design to overlap the circuit board fabrication lead time. The final assembly and testing will take place in house.